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0.50mm Mm BGA Solder Balls KIT 1 Bottlel

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0.50mm Mm BGA Solder Balls KIT 1 Bottlel

250K 0.50mm Mm BGA Solder Balls KIT 1 Bottlel

Price: $18.85
SKU: 70911
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Price in points: 189 points
Points: 2 points

Our wholesale prices:

Quantity  5+   20+   50+   100+ 
Price  $18.10   $17.53   $17.16   $16.78 
Description

- Parameters:
- SIZE: 0.50mm leaded Solder balls
- Balls Alloy: Sn 63/ Pb 37
- Melting point: 183℃
- Type: Leaded
- Compliant with RHOS
- Storage and Handling:
- Clean and dry enviroments are required for solder spheres storage.
- Probing of solder spheres in containers with finger or other implements can damage the solder spheres by changing its shape, scoring its surface or containmenting its surface by skin oils. Shelf life of all solder spheres, stored in sealed ESD containers that are not agitated, is 1 year.
- Temperature: 25 +/- 5 ℃
-  Humidity: 60 +/- 20% RH
- Reflow Profile:
- Recommend reflow profile is as below. In order to optimize the process for your specific application, experimentation is recommended.

- Lead type:
 
             TIN LEAD TYPE
Tin Lead Assemble
Average Ramp Up Rate
3 ℃/second max
Preheat Temperature
100℃~ 150
Preheat Time
60~120 Seconds
Peak Temperature
220℃~ 225
Time within 5 of actual Peak temperature
10~30 Seconds
Ramp Down Rate
6 ℃/second max.
Time 25 to Peak Temperature
6 minutes max
- Lead-free type:
            LEAD-FREE TYPE
Lead-Free Assemble
Average Ramp Up Rate
3 ℃/second max
Preheat Temperature
150℃~200
Preheat Time
60~180 Seconds
Peak Temperature
245℃~260
Time within 5 of actual Peak temperature
20~40 Seconds
Ramp Down Rate
6 ℃/second max.
Time 25 to Peak Temperature
8 minutes max

Previous: 250K 0.60 mm 0.60mm BGA Solder Balls PB Lead Free RoHS

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