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250K 0.45mm Mm BGA Solder Balls KIT 1 Bottlel

Price: $15.74

SKU: 70910

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Description

- Parameters:
- SIZE: 0.45mm leaded Solder balls
- Balls Alloy: Sn 63/ Pb 37
- Melting point: 183℃
- Type: Leaded
- Compliant with RHOS
- Storage and Handling:
- Clean and dry enviroments are required for solder spheres storage.
- Probing of solder spheres in containers with finger or other implements can damage the solder spheres by changing its shape, scoring its surface or containmenting its surface by skin oils. Shelf life of all solder spheres, stored in sealed ESD containers that are not agitated, is 1 year.
- Temperature: 25 +/- 5 ℃
- Humidity: 60 +/- 20% RH
- Reflow Profile:
- Recommend reflow profile is as below. In order to optimize the process for your specific application, experimentation is recommended.

- Lead type:

TIN LEAD TYPE	Tin Lead Assemble
Average Ramp Up Rate	3 ℃/second max
Preheat Temperature	100℃~ 150℃
Preheat Time	60~120 Seconds
Peak Temperature	220℃~ 225℃
Time within 5 ℃ of actual Peak temperature	10~30 Seconds
Ramp Down Rate	6 ℃/second max.
Time 25 ℃ to Peak Temperature	6 minutes ma

- Lead-free type:

LEAD-FREE TYPE	Lead-Free Assemble
Average Ramp Up Rate	3 ℃/second max
Preheat Temperature	150℃~200℃
Preheat Time	60~180 Seconds
Peak Temperature	245℃~260℃
Time within 5 ℃ of actual Peak temperature	20~40 Seconds
Ramp Down Rate	6 ℃/second max.
Time 25 ℃ to Peak Temperature	8 minutes max

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